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 Products & Services > Capabilities

Capabilities | Board Types | Materials | Special Services | Plating Process
Manufacturing | Technical Assistance

 Capabilities  
   Min. Line Width. Inner .004"
   Min. Line Width. Outer .004"
   Min. Space Trace/Trace= .004"
   Min. Space PCB Edge To Conductor .008"
   Layer to Layer Registration +/-.003"
   Min. Layer Thickness .003"
   Max. Layer Thichness .125"
   Max. PCB Finished Thickness .250"
   Hole Location Tolerance +/-.003"
   Min. Tolerance Outer Dimension +/-.005"
   Warpage .010"
   Min. Component Pitch. .012"
   Min. Ball Grid Array Pitch .020"
   Min. Dielectric Thickness .003"
   Min. Plated Hole Size .004"
   Tolerance Plated Hole Size +/-.002"
   Test Capabilites Full Net List Testing
   Soldermask Capabilities L.P.I.
Thermal
Carbon
Silk Screen
   Materials Available FR-4
Polyimide
Lead Free Material
Rogers Material
   Surface Finishes Available S.M.O.B.C.
Lead Free Solder
Au/Ni Plating
Au/Ni Electroless Plating.
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