HDI (HIGH DENSITY INTERCONNECT PCBS)

The science of reliability, on time delivery and competitive pricing.

Excello Circuits provides a complete range of services to our customers in PCB prototypes and PCB manufacturing, allowing them the freedom to have a one stop shop for their PCB requirements. Our product offerings include rigid PCBs, rigid flex PCBs and HDIs.

High Density Interconnects (HDI) are utilized to meet the market demand for complex designs in smaller form factors across the majority of market segments including Wireless, Telecom, Military, Medical, Semiconductor and Instrumentation. HDIs overcome the limitations found in standard circuit technologies through the utilization of ultra-thin cores, fine line processing and alternative via methods to reduce the size and weight of your components.

HDI PCBs have higherinterconnect density per unit area requiring more sophisticated technology and manufacturing processes for theirproduction. HDI PCBs are boards with high-density characteristics includingmicro-sized holes, fine lines and can be constructed with thin high performance materials, thereby enabling moreinterconnection functions per unit area.

HDI Structures
  • 1+N+1 ā€“ PCBs contain 1 "build-up" of high-density interconnection layers.
  • i+N+i (iā‰„2) - PCBs contain 2 or more "build-up" of high density interconnection layers. Microvias on different layers can be staggered or stacked. Copper filled stacked microvia structures are commonly seen in demanding designs.
  • Any Layer HDI - All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be freelyinterconnected with copper filled stacked microvia structures. This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.
Advanced Capabilities
  • Any layer HDI
  • Multilayer copper filled stacked micro via structure
  • 1.2/1.2 mil line/space
  • 3/9 mil laser via capture pad size
  • Embedded distributed and discrete passive components
  • Complex rigid-flex HDI products
  • Wide material and surface finish selections
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